Device for coating substrates in semiconductor production

Details Device for coating substrates in semiconductor production Device for coating substrates in semiconductor production

1994-06-30

1997-07-22

Bell, Janyce

Coating processes

Centrifugal force utilized

118 52, 118500, 4273855, 4274432, B05D 312

Patent

active

056501960

ABSTRACT:
A device for coating substrates has a capillary slot which is used in a first step to apply lacquer to the substrate. In a second step, the lacquer layer thickness of the substrate is reduced and made more uniform by spinning in a spinning device.

REFERENCES:
patent: 2046596 (1936-07-01), Zwiebel
patent: 4018953 (1977-04-01), Martellock
patent: 4119744 (1978-10-01), Brissot et al.
patent: 4851263 (1989-07-01), Ishii et al.
patent: 5199990 (1993-04-01), Zeniya
patent: 5270079 (1993-12-01), Bok
patent: 5275658 (1994-01-01), Kimura et al.
IBM Technical Disclosure Bulletin; vol. 32, No. 1; Jun. 1989 Upside-Down Resist Coating of Semiconductor Wafers.
IBM Technical Disclosure Bulletin; vo. 10, No. 5; Oct. 1967; Ultrasonic Fountain Processor; C. J. Keller.

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