Device for carrying thin wafers and method of carrying the...

Details Device for carrying thin wafers and method of carrying the... Device for carrying thin wafers and method of carrying the...

2007-05-22

2007-05-22

Rose, Robert A. (Department: 3723)

Abrading

Work holder

Vacuum

C269S021000

Reexamination Certificate

active

11116349

ABSTRACT:
A thin wafer carrying device includes a laminated board made of layers of compound material so that the thin wafer is put on the circular board. The compound material includes reinforcement material and high-polymer resin. A metal film good in electric conductivity is coated to the compound material. The compound material has been used in printed circuit boards. The carrying device includes a plurality of tiny holes and a vacuum system located beneath the circular board. The thin wafer is attracted on the carrying device by the method of vacuum and is convenient to be tested, processed and transported.

REFERENCES:
patent: 3811182 (1974-05-01), Ryan et al.
patent: 3949295 (1976-04-01), Moorshead
patent: 6019164 (2000-02-01), Getchel et al.
patent: 6386191 (2002-05-01), Yoshimura et al.

Affiliated with

Also associated with

Rating

Device for carrying thin wafers and method of carrying the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for carrying thin wafers and method of carrying the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for carrying thin wafers and method of carrying the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3794344