Device for bonding wire leads in electronic components

Details Device for bonding wire leads in electronic components Device for bonding wire leads in electronic components

1984-12-10

1986-09-09

Godici, Nicholas P.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228110, B23K 106

Patent

active

046103872

ABSTRACT:
There is disclosed an improved device for bonding wires in electronic components, of the type comprising a member for moving the capillary to a location close to the bonding area or region and an ultrasonic transducer including an arm carrying on one end the capillary, the transducer being pivoted to the approach member and having associated therewith a linear motor controlled by a position transducer.

REFERENCES:
patent: 3384283 (1968-05-01), Mims
patent: 3806019 (1974-04-01), Diepeveen

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