Device for bonding of lead wires for an integrated circuit devic

Details Device for bonding of lead wires for an integrated circuit devic Device for bonding of lead wires for an integrated circuit devic

1987-04-29

1988-12-13

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

29843, 29846, 29850, 29874, 228 45, 156382, 156556, 156566, 269 21, 279 3, B32B 3126

Patent

active

047908971

ABSTRACT:
Bonding of lead wires between electrical contact points of an integrated circuit and the conductive elements of a flexible tape-like structure on which the integrated circuit is seated is accomplished by means of a vacuum chuck having distributed recesses through which a partial vacuum is applied to the flexible structure. Support elements are provided with the vacuum recesses to ensure that the flexible tape-like structure presents a planar orientation to a bonding tool. The tape-like structure is maintained in a substantially rigid position during the bonding process enabling precision bonding of lead wires.

REFERENCES:
patent: 2781554 (1957-02-01), Robinson
patent: 3654019 (1972-04-01), Cusik
patent: 3812581 (1974-05-01), Larson
patent: 4050618 (1977-09-01), Angelucci
patent: 4627151 (1986-12-01), Mulholland

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