Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-03-22
2011-11-01
Fahmy, Wael (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257SE23019, C257SE23151, C257S758000
Reexamination Certificate
active
08049340
ABSTRACT:
An integrated circuit package substrate includes a first and an additional electrically conductive layer separated from each other by an electrically insulating layer, a contact pad formed in the first electrically conductive layer for making a direct connection between the integrated circuit package substrate and a printed circuit board, and a cutout formed in the additional electrically conductive layer wherein the cutout encloses an area that completely surrounds the contact pad for avoiding parasitic capacitance between the additional electrically conductive layer and the printed circuit board.
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Amin Amar
Hall Jeffrey
Jenkins Michael
Nikoukary Shawn
Fahmy Wael
LSI Corporation
Otterstedt, Ellenbogen & Kammer, LLP
Salerno Sarah
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