Metal working – Means to assemble or disassemble – Means to assemble electrical device
Patent
1996-07-18
1997-08-26
Vo, Peter
Metal working
Means to assemble or disassemble
Means to assemble electrical device
29742, 29743, 29793, 29840, 156542, 156566, 198341, 228 62, 228 37, 22818021, 414273, H05K 312, H05K 334, B23P 2100
Patent
active
056599471
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a device for automatically populating the top and bottom side of printed-circuit boards with SMD (surface mounted device) components.
BACKGROUND INFORMATION
In order for the printed-circuit boards to be populated, the printed circuit boards include a network of printed circuit traces on their bottom side, which functionally interconnect the component connection points provided therein. These printed-circuit boards run on a conveyor belt through the individual processing stations and also pass through devices for fitting the printed-circuit board from above, so-called automatic insertion equipment or SMD-insertion devices, which transport the components to predetermined positions on the top side of the printed-circuit board. For this purpose, the automatic insertion equipment is provided with grippers, which are able to be controlled in a horizontal plane to every point of the printed-circuit board surface. The components, themselves, are stockpiled on a carrier, which in many cases is rolled up into a spool. The components are removed from this carrier, one after another, e.g., by means of a component extractor (suction device) and taken to the designated position.
After all the SMD components required for the circuit arrangements mapped on the printed-circuit board are set down, the components are soldered to their connection points in a soldering station, and the circuit arrangement is then checked for proper functioning.
The desire to keep the overall space required for these circuit arrangements to a minimum has resulted in SMD components being mounted on the bottom side of the printed-circuit boards as well. For this purpose, after leaving the soldering station, the printed-circuit board is lifted off the conveyor belt and is inverted, and the bottom side of the printed-circuit board, now located on top, is provided with an adhesive agent at the surface mounted placements there for the SMD components. The printed-circuit board subsequently passes through second automatic insertion equipment or SMD-insertion devices and the now upwardly pointing bottom side of the printed-circuit board is fitted with other SMD components.
Following the second automatic insertion equipment, the adhesive agent is cured in a hardening station, so that the components adhere securely to the printed-circuit board; the printed-circuit board is then inverted again and subsequently run through a wave-soldering station to solder the components on the bottom side to the printed circuit traces.
In some instances, components, which are not able to be manipulated using a component extractor (suction device), are even placed beforehand by hand on the top side of the printed-circuit board.
SUMMARY OF THE INVENTION
The underlying object of the present invention is to minimize the placement of components by hand if possible. Accordingly, a device is provided for automatically populating the top and bottom side of printed-circuit boards with SMD components, which includes synchronously controllable switching points that are arranged in the entry and outlet of the SMD insertion device.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a functional block diagram (flow chart) of a device according to the present invention.
DETAILED DESCRIPTION
The device according to the present invention removes the unfinished printed-circuit boards from a storage container 1 and places them on a conveyor belt with the top side pointing up. Soldering paste is imprinted in a generally known way on to this side of the unfinished printed-circuit board in the subsequent soldering-paste printing station 2 at the contact points for the SMD components to be fitted, but also at the contact holes for connections for printed circuit traces on the top side to such printed circuit traces on the bottom side of the printed-circuit board. The printed-circuit board is then situated in front of a first switch point (rounting means) 3 having two entries 4 and 5 and one outlet 6, which is situated in the entry
REFERENCES:
patent: 4719694 (1988-01-01), Herberich et al.
patent: 5003692 (1991-04-01), Izumi et al.
patent: 5329690 (1994-07-01), Tsuji et al.
patent: 5338381 (1994-08-01), Hidese
patent: 5452509 (1995-09-01), Suzuki et al.
patent: 5564183 (1996-10-01), Satou et al.
"Surface-Mounted Device Placement" IBM Technical Disclosure Bulletin, vol. 30, No. 1, Jun. 1987, pp. 228-234.
Eilers Norbert
Graen Ansgar
Blaupunkt-Werke GmbH
Vo Peter
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