Device for attaching modular electronic components to or removin

Details Device for attaching modular electronic components to or removin Device for attaching modular electronic components to or removin

1984-09-10

1987-04-21

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 8, 228 9, 228 491, 228 565, 81448, B23K 300

Patent

active

046590048

ABSTRACT:
A device is disclosed for attaching to or removing modular electronic components from a substrate which is adjustably positioned beneath a heater means delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon by a series of changeable nozzles which can be moved into or out of registry with the component. Vacuum means is also provided for contacting the component to position it on or remove it from the substrate.

REFERENCES:
patent: 2745451 (1956-05-01), Neil
patent: 3356830 (1967-12-01), Schleer et al.
patent: 3869242 (1975-03-01), Schladitz
patent: 4021068 (1977-05-01), Piazza
patent: 4151945 (1979-05-01), Ragard et al.
patent: 4295596 (1981-10-01), Doten et al.
patent: 4426571 (1984-01-01), Beck
patent: 4561584 (1985-12-01), Hug
patent: 4569473 (1986-02-01), Guiliano

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