Device for attaching modular electronic components to or removin

Details Device for attaching modular electronic components to or removin Device for attaching modular electronic components to or removin

1984-04-02

1986-11-04

Godici, Nicholas P.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

By fluid blast or suction

228191, 228264, B23K 2900

Patent

active

046206590

ABSTRACT:
The invention is a device for attaching or removing electronic components from a substrate and includes a nozzle for delivering heat to the terminal areas of the substrate. The nozzle includes a first plate, spaced from the component, having openings corresponding to the terminals of the component. The nozzle further includes a second portion below the plate for directing heated fluid to the component. Further, at least one opening in the plate is enlarged to delivery more heat to certain terminals connected to a ground plate, for example.

REFERENCES:
patent: 3746239 (1973-07-01), Auray
patent: 4136444 (1979-01-01), Durney
patent: 4426571 (1984-01-01), Beck

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