Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1990-05-09
1993-06-29
Nguyen, Nam X.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429809, 20429811, 20429814, C23C 1434
Patent
active
052231119
ABSTRACT:
One piece hollow members 6, 7 supported at the wall of the vacuum chamber 1 are provided parallel to the plane of the cathode 12 and in the area between the cathode 12 and the anode 4, 5. These members have axis-parallel conduits 6a, 6b, 6d, 7a, 7b, 7d passed through by both the temperature-regulating medium and the process gas. The hollow members 6, 7 have openings 6e, 6e', . . . , 7e, 7e', . . . which run transversely to the longitudinal axis of the conduits for the process gas to emerge into the vacuum chamber 1.
REFERENCES:
patent: 4412906 (1983-11-01), Sato et al.
patent: 4425218 (1984-01-01), Robinson
patent: 4572842 (1986-02-01), Dietrich et al.
patent: 4849087 (1989-07-01), Meyer
patent: 4946576 (1990-08-01), Dietrich et al.
Leybold Aktiengesellschaft
Nguyen Nam X.
LandOfFree
Device for applying thin layers onto a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device for applying thin layers onto a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for applying thin layers onto a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1752739