Device for applying solder

Details Device for applying solder Device for applying solder

1988-06-01

1989-02-28

Godici, Nicholas P.

Metal fusion bonding

Process

With clamping or holding

228 563, 228 57, 228242, 228256, B23K 3102

Patent

active

048077992

ABSTRACT:
A device for applying solder to two opposite faces of an object, such as an array of conductors of a flat electrical cable, in a predetermined location, comprises a support sheet having a line of weakness along which the sheet can be folded to define two arms, each having a free end; a quantity of solder located on a face of each of the arms of the support sheet; and means for controlling flow of the solder, when heated, in a direction perpendicular to the line of weakness. The controlling means may be a strip of a resiliently deformable material.

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