Device for aligning printed circuit boards and pattern carriers

Supports: racks – Special article – Platelike

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Details

2483092, 361735, 361741, 361790, 269 47, 269903, A47G 1908

Patent

active

055668402

ABSTRACT:
The device is used for the mutual alignment of perforated printed circuit boards and pattern carriers, for example films. It consists of a support (10) with parallel pins (16) axially slidable and laterally immovable within guides disposed thereon. In order to achieve a very exact alignment of the printed circuit boards and the films in spite of unavoidable tolerances regarding the position and the diameter of the centering bores cooperating with the pins (16), the pins are substantially polygonal in cross-section, having parallel lateral surfaces with either chamfered or rounded corners. The corners of the pins taper from the support (10) toward their free ends. They furthermore can be retracted into the support (10) using an actuator to prevent the tilting of the printed circuit boards in the course of their removal.

REFERENCES:
patent: 2518624 (1950-08-01), Kraft
patent: 4415983 (1983-11-01), Lachman et al.
patent: 4463310 (1984-07-01), Whitley
patent: 4935695 (1990-06-01), Hayes et al.
patent: 5106309 (1992-04-01), Matsuoka et al.
patent: 5241454 (1993-08-01), Ameen et al.
patent: 5309327 (1994-05-01), Slater
patent: 5418688 (1995-05-01), Hertz et al.
patent: 5451883 (1995-09-01), Staab
IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978, "Chip-Module (Board) Package For High Speed Computer Technology" By N. Braslau.
Nepcon West, technical paper entitled "Registration Systems and Tooling For Multilayer Manufacturing", by Michael Angelo, 1981.

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