Device for adjusting space between chip in semiconductor chip te

Details Device for adjusting space between chip in semiconductor chip te Device for adjusting space between chip in semiconductor chip te

1998-09-30

2000-05-30

Kramer, Dean J.

Handling: hand and hoist-line implements

Grapple

Multiple grapples for multiple objects

294 65, 4147521, B65B 3538

Patent

active

060683171

ABSTRACT:
Device for adjusting a space between chips in a semiconductor chip tester, is disclosed, including a carrier plate mounted movable along a horizontal guide rail, a mounting plate fixed to the carrier plate, an elevating plate mounted on the mounting plate movable in up and down direction by a vertical LM (linear motion) guider, a cam shaft rotatably mounted on the elevating plate, the cam shaft having a plurality of cam grooves formed in a radial direction in an outer circumferential surface, a driving mechanism for rotating the cam shaft, and a plurality of pick-up members each fitted movable in a horizontal direction by a horizontal LM guider in a state a top of each of the pick-up members is inserted in one of the cam grooves.

REFERENCES:
patent: 4597819 (1986-07-01), Kusuhara et al.
patent: 4695217 (1987-09-01), Lau
patent: 4957406 (1990-09-01), Akagawa
patent: 5273152 (1993-12-01), Brun
patent: 5284413 (1994-02-01), Wilkinson et al.
patent: 5290134 (1994-03-01), Baba
patent: 5575376 (1996-11-01), Colamussi
patent: 5755473 (1998-05-01), Swain et al.
patent: 5839769 (1998-11-01), Slocum et al.
patent: 5851296 (1998-12-01), Haraguchi et al.
patent: 5919024 (1999-07-01), Fujimori

Affiliated with

Also associated with

Rating

Device for adjusting space between chip in semiconductor chip te does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for adjusting space between chip in semiconductor chip te, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for adjusting space between chip in semiconductor chip te will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1905301