Device fabrication involving planarization

Details Device fabrication involving planarization Device fabrication involving planarization

1996-08-01

1998-04-07

Fourson, George R.

Fishing, trapping, and vermin destroying

427370, 427103, 437229, H01L 21311

Patent

active

057364249

ABSTRACT:
Planarization of geometrically difficult semiconductor device surfaces is accomplished utilizing a coating technique in which on an object with a flat surface is used to planarize the coating material. In particular, device processing is accomplished by including a step that produces a planar surface by coating a nonplanar surface with a material that has a viscosity of less than 1000 cp. An object with a flat surface is placed into contact with the material in such a manner that the material is planarized to a desired degree. The material is cured while in contact with the object's flat surface. The object is then separated from the material. The planarity of the planarizing material is then transferred into the underlying layer using conventional techniques.

REFERENCES:
patent: 4515828 (1985-05-01), Economy et al.
patent: 4553153 (1985-11-01), McColgin et al.
patent: 4599136 (1986-07-01), Araps et al.
patent: 4619837 (1986-10-01), Brown
patent: 4635356 (1987-01-01), Ohuchi et al.
patent: 4643910 (1987-02-01), Foutz
patent: 4689289 (1987-08-01), Crivello
patent: 4698294 (1987-10-01), Lau et al.
patent: 4699803 (1987-10-01), Araps et al.
patent: 4713356 (1987-12-01), Hiruta
patent: 4741926 (1988-05-01), White et al.
patent: 4871619 (1989-10-01), Araps et al.
patent: 4882201 (1989-11-01), Crivello et al.
patent: 4983545 (1991-01-01), Gokan et al.
patent: 5013609 (1991-05-01), Yamamoto et al.
patent: 5137751 (1992-08-01), Burgess et al.
patent: 5276126 (1994-01-01), Rogler
patent: 5367766 (1994-11-01), Burns et al.
patent: 5434107 (1995-07-01), Paranjpe
"Planarization Properties of Resist and Polyimide Coatings", by L. K. White, Journal of the Electrochemical Society: Solid-State Science and Technology, Jul. 1983, pp. 1543-1548.
"Planarization of Phosphorus-Doped Silicon Dioxide", by A. C. Adams et al., Journal of the Electrochemical Society: Solid-State Science and Technology, Feb. 1981, vol. 128, No. 2, pp. 423-429.
"Properties of Thin Polyimide Films", by L. B. Rothman, Journal of the Electrochemical Society: Solid-State Science and Technology, vol. 127, No. 10, Oct. 1980, pp. 2216-2220.
"High Resolution, Steep Profile Resist Patterns", by J. M. Moran et al., J. Vac. Sci. Technol., vol. 16(6), Nov./Dec. 1979, pp. 1620-1624.
"Multilayer Resist Systems for Lighography", by M. Hatzakis, Solid State Technology, Aug. 1981, pp. 74-80.
Trilayer Resist Processing Using Spin-On Glass Intermediate Layers, by S. K. Gupta et al., SPIE, vol. 469 Advances in Resist Tecnology (1984), pp. 3-12.

Affiliated with

Also associated with

Rating

Device fabrication involving planarization does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device fabrication involving planarization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device fabrication involving planarization will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-12669