Device clamp for reducing oxidation in wire bonding

Details Device clamp for reducing oxidation in wire bonding Device clamp for reducing oxidation in wire bonding

2007-05-01

2009-11-10

Stoner, Kiley (Department: 1793)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S042000, C228S044700

Reexamination Certificate

active

07614538

ABSTRACT:
A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire bonding machine. The body portion includes a inlet port for receiving a fluid from a gas supply source. The body portion defines a fluid path from the inlet port to the at least one device aperture.

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