Device assembly facilitating gap filling between spaced layers o

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

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Details

257778, 257732, 257734, 257774, 765 801, 438108, 438126, 361734, H01L 2344, H01L 2348, H01L 2940, F28F 700

Patent

active

061246433

ABSTRACT:
A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.

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