Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1998-12-10
2000-09-26
Williams, Alexander O.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257778, 257732, 257734, 257774, 765 801, 438108, 438126, 361734, H01L 2344, H01L 2348, H01L 2940, F28F 700
Patent
active
061246433
ABSTRACT:
A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.
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Micro)n Technology, Inc.
Williams Alexander O.
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