Device and process for liquid treatment of wafer-shaped...

Details Device and process for liquid treatment of wafer-shaped... Device and process for liquid treatment of wafer-shaped...

2007-09-11

2007-09-11

Perrin, Joseph L. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S140000, C134S149000, C134S153000, C134S157000, C134S902000, C118S052000

Reexamination Certificate

active

11367330

ABSTRACT:
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.

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