Device and process for liquid treatment of wafer-shaped...

Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment

Reexamination Certificate

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C134S034000, C134S902000, C438S745000, C216S096000

Reexamination Certificate

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06858092

ABSTRACT:
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.

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patent: 6334902 (2002-01-01), Mertens et al.
patent: 0 810 641 (1997-12-01), None
patent: 9-181026 (1997-07-01), None

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