Coating apparatus – Gas or vapor deposition – Having means to expose a portion of a substrate to coating...
Reexamination Certificate
2011-07-12
2011-07-12
Kackar, Ram N (Department: 1716)
Coating apparatus
Gas or vapor deposition
Having means to expose a portion of a substrate to coating...
C118S715000, C118S504000
Reexamination Certificate
active
07976633
ABSTRACT:
A film forming device includes a mask member that is made of silicon and has first openings of predetermined patterns; a magnetic member that is made of a magnetic material and has a second opening, and that is aligned with the mask member so that the first openings are arranged in the second opening in plan view of the second opening; and a substrate holding member that generates magnetic force between the magnetic member and itself in order to adhere the mask member and a substrate to each other. The mask member and the substrate are interposed between the magnetic member and the substrate holding member in this order from the magnetic member.
REFERENCES:
patent: 3661567 (1972-05-01), Yamamoto
patent: 4599970 (1986-07-01), Peterson
patent: 4615781 (1986-10-01), Boudreau
patent: 4733271 (1988-03-01), Arai
patent: 6259174 (2001-07-01), Ono
patent: 6271469 (2001-08-01), Ma et al.
patent: 6852356 (2005-02-01), Nishikawa
patent: 6875542 (2005-04-01), Yotsuya
patent: 7097750 (2006-08-01), Kang et al.
patent: 2002/0059903 (2002-05-01), Hasegawa et al.
patent: 2002/0162998 (2002-11-01), Okuda et al.
patent: 2004/0137147 (2004-07-01), O'Donnell et al.
patent: 2006/0049044 (2006-03-01), Seddon
patent: 2006/0086321 (2006-04-01), Brody et al.
patent: 2009/0074952 (2009-03-01), Yamazaki et al.
patent: 54-124052 (1978-02-01), None
patent: 59-056579 (1984-04-01), None
patent: 61-249795 (1986-11-01), None
patent: 62-202491 (1987-09-01), None
patent: 10-041069 (1998-02-01), None
patent: 2001-237073 (2001-08-01), None
patent: 2002-047560 (2002-02-01), None
patent: 2002-296562 (2002-10-01), None
patent: 2003-100460 (2003-04-01), None
patent: 2003-231961 (2003-08-01), None
Communication from Korea Patent Office regarding counterpart application.
Kanemaru Shinji
Yotsuya Shinichi
Chandra Satish
Harness & Dickey & Pierce P.L.C.
Kackar Ram N
Seiko Epson Corporation
LandOfFree
Device and method of forming film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device and method of forming film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device and method of forming film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2712627