Device and method of cutting off a portion of masking film adher

Details Device and method of cutting off a portion of masking film adher Device and method of cutting off a portion of masking film adher

1987-01-23

1988-10-25

Kazenske, E. R.

Cutting

Processes

With preparatory or simultaneous ancillary treatment of work

82 51, 83 27, 83109, 83171, 836511, 83733, 83734, 156267, B23B 100, B23B 500, B26F 312

Patent

active

047794976

ABSTRACT:
A method of cutting off a masking film of a silicon wafer comprising the steps of rotating the silicon wafer, feeding a heat wire continuously to the outer periphery of the silicon wafer and cutting off the outer periphery of the masking film along the outer perphery of the silicon wafer.

REFERENCES:
patent: 3677118 (1972-07-01), Abbott et al.
patent: 4018117 (1977-04-01), Patterson
patent: 4063609 (1986-08-01), Takatoshi
patent: 4494523 (1985-01-01), Wells
patent: 4522679 (1985-06-01), Funakoshi et al.

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