Device and method for wave soldering

Details Device and method for wave soldering Device and method for wave soldering

2007-05-22

2011-12-06

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

C228S037000, C228S042000, C228S260000

Reexamination Certificate

active

08070049

ABSTRACT:
The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located above the solder reservoir so as to exclude oxygen and with means for introducing the protective and/or active gas as well as an enclosure being provided, with the enclosure being configured in such a manner that it encloses at least the essential parts of a solder zone.

REFERENCES:
patent: 5044542 (1991-09-01), Deambrosio
patent: 5121874 (1992-06-01), Deambrosio et al.
patent: 5121875 (1992-06-01), Hergerty et al.
patent: 5176307 (1993-01-01), Hagerty et al.
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5320274 (1994-06-01), Precious et al.
patent: 5358167 (1994-10-01), Tachibana et al.
patent: 5409159 (1995-04-01), Connors et al.
patent: 5411200 (1995-05-01), Connors et al.
patent: 5509598 (1996-04-01), Nayar et al.
patent: 5769305 (1998-06-01), Takeda et al.
patent: 6116491 (2000-09-01), Katoh
patent: 6305596 (2001-10-01), Lin et al.
patent: 6352190 (2002-03-01), Lucht et al.
patent: 6378753 (2002-04-01), Schellen et al.
patent: 2004/0060960 (2004-04-01), Becker et al.
patent: 4421996 (1996-01-01), None
patent: 195 41 445 (2005-02-01), None
patent: 0761361 (1997-03-01), None
patent: WO 92/10323 (1992-06-01), None

Affiliated with

Also associated with

Rating

Device and method for wave soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device and method for wave soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device and method for wave soldering will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4310155