Device and method for treating the surfaces of substrates

Details Device and method for treating the surfaces of substrates Device and method for treating the surfaces of substrates

2011-01-04

2011-01-04

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Longitudinally traveling work of bar, strip, strand, sheet...

C134S021000, C427S350000

Reexamination Certificate

active

07862661

ABSTRACT:
The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafer, and at least one conveyor device which wets the surface of the silicon wafer with an aqueous medium on a transport plane which is determined by the transport rollers. The conveyor device is configured such that it can apply the process medium to the surface of the silicon wafer, which is oriented in a downward manner and which is arranged on the transport plane. Several suction pipes for suctioning gaseous or mist-like distributed process mediums from the area surrounding the conveyor device are provided. The suction pipes are arranged in the vertical direction below the transport plane.

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Office Action dated May 12, 2009 issued in co-pending U.S. Appl. No. 12/139,317.

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