Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1997-05-06
1999-10-19
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
156345, 216 89, 438693, H01L 2100
Patent
active
059688416
ABSTRACT:
A device and method for preventing settlement of particles on a chemical-mechanical polishing pad is provided. Specifically, a device capable of preventing settlement of particles on the pad is located between the polishing pad and a platen of a chemical-mechanical polishing apparatus.
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Landers William Francis
Lofaro Michael Francis
Ticknor Adam Dan
Blecker Ira D.
International Business Machines - Corporation
Powell William
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