Device and method for preventing settlement of particles on a ch

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

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156345, 216 89, 438693, H01L 2100

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active

059688416

ABSTRACT:
A device and method for preventing settlement of particles on a chemical-mechanical polishing pad is provided. Specifically, a device capable of preventing settlement of particles on the pad is located between the polishing pad and a platen of a chemical-mechanical polishing apparatus.

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Brochure on PZT QuickPack by Active Control eXperts, Inc., 1995.

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