Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1998-05-19
2000-04-18
Bueker, Richard
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
438 8, 216 88, 216 89, 156345, H01L 21304
Patent
active
060515007
ABSTRACT:
The present invention provides a method for polishing a semiconductor substrate having a first layer of material formed on a second layer of different material. In one embodiment, the method includes placing the semiconductor substrate against a polishing surface and polishing the semiconductor substrate, producing a first vibration by polishing and removing the first layer, producing a second vibration by polishing at least a portion of the second layer, and detecting a change from the first vibration to the second vibration with a vibration sensor. The vibration that is sensed in the present invention is physical or mechanical vibration, and it is not a vibration associated with a change in temperature. The vibration sensor may be of varying types. For example, the vibration sensor may be an acoustic sensor or an ultrasonic sensor.
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Maury Alvaro
Nanda Arun K.
Rodriguez Omar
Bueker Richard
Lucent Technologies - Inc.
Powell Alva C
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