Device and method for package warp compensation in an...

Details Device and method for package warp compensation in an... Device and method for package warp compensation in an...

2005-02-01

2005-02-01

Smith, Matthew (Department: 2825)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S840000, C716S030000, C716S030000

Reexamination Certificate

active

06848172

ABSTRACT:
A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built to compensate for deformations resulting from (1) physical manipulation during assembly, (2) thermal gradients during operation, and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

REFERENCES:
patent: 6139975 (2000-10-01), Mawatari et al.
patent: 6203191 (2001-03-01), Mongan
patent: 6466446 (2002-10-01), Nagy et al.
Kelly, G. , et al., “Accurate Prediction of PQFP Warpage”,IEEE Proceedings of the Electronic Components and Technology Conference, 44,Washington, (1994), 102-106.
Metrol, A., “Stress Analysis and Thermal Characterization of a High Pin Count PQFP”,Transactions of the ASME: Journal of Electronic Packaging, 114,(1992), 211-220.
Zhang, X., et al., “Thermo-Mechanical Analysis for a Multi Chip Build Up Substrate Based Package”,Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2001(Cat. No 01th8548), (2001), 67-72.

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