Device and method for on-die temperature measurement

Refrigeration – Structural installation – With electrical component cooling

Reexamination Certificate

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C702S132000, C713S300000

Reexamination Certificate

active

07878016

ABSTRACT:
A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.

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