Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-11-25
2000-01-25
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29720, 29740, 29759, 414730, 901 40, 901 47, H05K 330
Patent
active
060165995
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to an electronic components mounting machine and a mounting method of electronic components. Especially, the present invention is characterized in that electronic components are mounted on a substrate by applying a correction to mounting operations according to deformations of the substrate.
BACKGROUND OF THE INVENTION
In general, almost all the electronic components mounting machines have so far been provided with capabilities of applying a correction to mounting operations according to deformations observed on a substrate where electronic components are mounted.
Such a correction applied to prior art electronic components mounting machines will be explained with reference to FIG. 8.
In FIG. 8(a), recognition marks 2 and 3 are located on each of two corners of a substrate 1, respectively, where the two corners are situated diagonally opposite to each other. With a prior art electronic components mounting machine, when the substrate 1 is deformed from an ideal configuration as indicated by solid lines in FIG. 8(a) to a configuration indicated by dotted lines, the position of the recognition mark 3 is shifted accordingly. A constant deformation ratio is obtained by calculation from the magnitude of shifting of the recognition marks 2 and 3 and a correction is applied to mounting positions of the electronic components mounting machine by the use of the deformation ratio. In this case, however, it is assumed that the deformation of the substrate 1 is taking place uniformly in both the X and Y directions as illustrated in FIG. 8(a).
When deformations appear nonuniformly in the X and Y directions as shown in FIG. 8(b), the two recognition marks 2 and 3 do not provide correct information on the deformations, thereby not allowing the derived deformation ratio to represent the actual deformations of the substrate 1. Particularly, as large size substrates are used more and more recently, the adverse effect of nonuniform deformations is no longer neglected.
Thus, the prior art electronic components mounting machines have presented a problem of inability to cope sufficiently with the deformations of substrates when large size substrates are used and/or a high precision mounting performance is required of electronic components mounting machines.
SUMMARY OF THE INVENTION
The object of the present invention is to provide an electronic mounting machine whereby a high precision mounting performance is achieved through a proper process of correction employed against whatever deformations applied to substrates.
An electronic component mounting machine of the present invention comprises an actuator for mounting electronic components on a substrate, a detector for identifying recognition marks that are located at least on four places of the substrate and detecting coordinates of the recognition marks, a controller to control the foregoing actuator, a mounting data table for storing information on mounting coordinates and mounting angles of the electronic components to be mounted and a correction data table for storing information on correction values to be applied to the foregoing mounting coordinates and mounting angles in reference to the substrate, on which electronic components are mounted, wherein the foregoing correction data table stores information on correction values for each respective cell formed by dividing the substrate into a plurality of small sections according to a specified rule in reference to the coordinates of at least four recognition marks and the information on the mounting coordinates and angles stored in the foregoing mounting data table is corrected by the information on correction values stored in the foregoing correction data table corresponding to a cell on the substrate where a specific electronic component is mounted, thereby mounting of the foregoing electronic components being successfully performed.
In the structure as described in the above, a substrate is divided into a plurality of cells by a specified rule, information on corre
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IBM Tech Discl Bull vol. 29 No. 11 Apr. 1987 pp. 4960-4962.
Kashiwagi Yasuhiro
Morita Takeshi
Arbes Carl J.
Matsushita Electric - Industrial Co., Ltd.
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