Device and method for lithography

Plastic article or earthenware shaping or treating: apparatus – Preform reshaping or resizing means: or vulcanizing means... – Surface deformation means only

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S174400, C425S387100, C425S389000, C425S405100

Reexamination Certificate

active

07997890

ABSTRACT:
Apparatus and method for transferring a pattern from a template (10) having a structured surface to a substrate (12) carrying a surface layer of a radiation polymerisable fluid (14). The apparatus comprises a first main part (101) and a second main part (102) having opposing surfaces (104;105), means for adjusting a spacing (115) between said main parts, support means (106) for supporting said template and substrate in mutual parallel engagement in said spacing with said structured surface facing said surface layer, a radiation source (110) devised to emit radiation into said spacing. A cavity (115) has a first wall comprising a flexible membrane (113) devised to engage said template or substrate, and means (114;116) are provided for applying an adjustable overpressure to a medium present in said cavity, whereby an even distribution of force is obtained over the whole of the contact surface between the substrate and the template. The apparatus further includes a heater device having a surface facing said spacing, for heating either fluid layer (14).

REFERENCES:
patent: 4054383 (1977-10-01), Lin et al.
patent: 4233261 (1980-11-01), Mijnheer
patent: 4312823 (1982-01-01), Kraakman et al.
patent: 4360266 (1982-11-01), Takeuchi
patent: 4844947 (1989-07-01), Kasner et al.
patent: 5804017 (1998-09-01), Hector
patent: 5866281 (1999-02-01), Guckel et al.
patent: 5947027 (1999-09-01), Burgin et al.
patent: 6027630 (2000-02-01), Cohen
patent: 6190929 (2001-02-01), Wang et al.
patent: 6284345 (2001-09-01), Ruoff
patent: 6334960 (2002-01-01), Willson et al.
patent: 6387778 (2002-05-01), Bonin et al.
patent: 6387787 (2002-05-01), Mancini et al.
patent: 6482742 (2002-11-01), Chou
patent: 6743740 (2004-06-01), Brask
patent: 6949199 (2005-09-01), Gauzner et al.
patent: 7144539 (2006-12-01), Olsson
patent: 7374864 (2008-05-01), Guo et al.
patent: 2003/0159608 (2003-08-01), Heidari
patent: 2003/0189273 (2003-10-01), Olsson
patent: 2004/0021254 (2004-02-01), Sreenivasan et al.
patent: 2004/0079730 (2004-04-01), Ahrens et al.
patent: 2004/0131718 (2004-07-01), Chou et al.
patent: 2005/0158419 (2005-07-01), Watts et al.
patent: 2005/0202350 (2005-09-01), Colburn et al.
patent: 1478642 (2004-03-01), None
patent: 36 43817 (1988-06-01), None
patent: 2-289311 (1990-11-01), None
patent: 02289311 (1990-11-01), None
patent: 11191240 (1999-07-01), None
patent: 2000-194142 (2000-07-01), None
patent: 2003-77867 (2003-03-01), None
patent: 2003-077867 (2003-03-01), None
patent: 2003-516644 (2003-05-01), None
patent: 2003-272998 (2003-09-01), None
patent: WO 01/33300 (2001-05-01), None
patent: WO 01/42858 (2001-06-01), None
patent: 02/07199 (2002-01-01), None
patent: WO 02/07199 (2002-01-01), None
patent: WO 02/067055 (2002-08-01), None
patent: WO 03/005124 (2003-01-01), None
patent: 03/073164 (2003-09-01), None
Resnick et al.; “Imprint Lithography for Integrated Circuit Fabrication”; Journal of Vacuum Science & Technology B, vol. 21, No. 6, pp. 2624-2631, (2003).
Heidari et al.; “Large Scale Nanolithography Using Nanoimprint Lithography”; Journal of Vacuum Science & Technology B, vol. 17, No. 6, pp. 2961-2964, (1999).
Wissen et al., “UV Curing of Resists for Warm Embossing”, Elsevier B.V., Microelectronic Engineering, vol. 73-74, pp. 184-187, (2004).
Reano et al., “Stability of Functional Polymers After Plasticizer-Assisted Imprint Lithography”, Journal of Vaccum Science & Technology, American Vacuum Society, vol. 22, No. 6, pp. 3294-3299, (2004).
Bender et al., “Fabrication of Nanostructures Using a UV-Based Imprint Technique”, Elsevier B.V., Microelectronic Engineering, vol. 53, pp. 233-236, (2000).
M. Colburn et al., “Step and Flash Imprint Lithography: A New Approach to High-Resolution Patterning,”Proceedings of the SPIE, vol. 3676, Mar. 15, 1999, pp. 379-389, XP008011830.
English language version of “Notification of the First Office Action” in corresponding Chinese App. No. 200510081756.4, Notification Date Jun. 6, 2008.
English language version of “Notification of the Second Office Action” in corresponding Chinese App. No. 200510081756.4, Notification Date Jul. 10, 2009.
Office Action in corresponding U.S. Appl. No. 10/581,497, Date Nov. 25, 2009 (16 pages).
Office Action in corresponding U.S. Appl. No. 11/579,540, Date May 13, 2009 (19 pages).
Office Action in corresponding U.S. Appl. No. 11/123,087, Date Feb. 3, 2009 (11 pages).
Office Action in corresponding U.S. Appl. No. 11/123,087, Date Jun. 27, 2008 (8 pages).
Office Action in corresponding U.S. Appl. No. 11/123,087, Date Oct. 10, 2007 (9 pages).
Office Action in corresponding U.S. Appl. No. 11/579,540 mailed May 7, 2010 (24 pages).
Office Action in corresponding U.S. Appl. No. 10/581,497 mailed May 4, 2010 (17 pages).
Office Action in corresponding Japanese Patent Application No. 2005-136511 mailed Jul. 30, 2010 and English translation.
Official Action from corresponding European Application No. 04 445 057.5 dated Oct. 25, 2010.
Office Action in corresponding U.S. Appl. No. 10/581,497 mailed Mar. 24, 2011 (14 pages).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Device and method for lithography does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device and method for lithography, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device and method for lithography will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2708848

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.