Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-12-04
2000-02-29
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361760, 361783, 361764, 361765, 257686, 257690, 257784, 22818021, 174255, 174260, 174262, H05K 111
Patent
active
060317280
ABSTRACT:
The present invention relates to the interconnection of two electronic devices (2 and 3) by means of an interconnection device (1).
According to the invention, the interconnection device (1) has metallized grooves (17, 18) in its edge, each in electrical connection with one of its lower contacts (15). Portions of solder (20), partially accommodated in the grooves (17, 18), fasten the interconnection device (1) on the electronic device (3) and make the electrical connections between the devices (1 and 3).
REFERENCES:
patent: 5138115 (1992-08-01), Lam
patent: 5313366 (1994-05-01), Gaudenzi et al.
patent: 5369551 (1994-11-01), Gore et al.
patent: 5388029 (1995-02-01), Moriyama
patent: 5477933 (1995-12-01), Nguyen
patent: 5703405 (1997-12-01), Zeber
Patent Abstracts Of Japan, vol. 18, No. 340, (E-1569), Jun. 27, 1994, (Japanese '569).
Patent Abstracts Of Japan, vol. 13, No. 123, (E-733) (Japanese '733).
Patent Abstracts Of Japan, vol. 96, No. 10, Oct. 31, 1996, (Japanese '438.
Patent Abstracts Of Japan, vol. 15, No. 50, (E-1030), Feb. 6, 1991, (Japanese '030).
Patent Abstract Of Japan, vol. 18, No. 590, (E-1628), Nov. 10, 1994, (Japanese '628).
Bedos Jean-Philippe
Sune Gerard
Aerospatiale - Societe Nationale Industrielle
Foster David
Picard Leo P.
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