Device and method for including passive components in a chip...

Details Device and method for including passive components in a chip... Device and method for including passive components in a chip...

2006-07-28

2008-11-11

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S612000, C438S613000, C257S778000, C257S779000, C257S780000, C257S738000

Reexamination Certificate

active

07449364

ABSTRACT:
The invention provides a method and device for building one or more passive components into a chip scale package. The method includes the steps of selecting a passive component having a terminal pitch that is a multiple of the package ball pitch of a chip scale package and mounting the selected passive component terminals to ball sites of the package. A preferred embodiment of the invention uses a single metal layer polyamide tape as the substrate of the package. Additional preferred embodiments of the invention are disclosed in which the terminal pitch multiple of the package ball pitch is one or two. Devices corresponding to the disclosed methods are also disclosed.

REFERENCES:
patent: 5956576 (1999-09-01), Toy et al.
patent: 6636416 (2003-10-01), Li et al.
patent: 6657133 (2003-12-01), Chee

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