Device and method for improving corrosion resistance and etch to

Details Device and method for improving corrosion resistance and etch to Device and method for improving corrosion resistance and etch to

1995-09-29

1998-11-03

Breneman, R. Bruce

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

216 49, 134 12, B08B 600, B44C 122

Patent

active

058302794

ABSTRACT:
A device and method for removing contaminants from semiconductor wafers and from the interior of wafer processing chambers in which the temperature inside the chambers is raised to sufficiently high levels for short time periods. In a wafer etching chamber, heat cleaning is performed after wafer removal and lessens the required frequency of other cleaning methods and in doing so reduces the time the chamber is unavailable. In a mask removal chamber, heat cleaning is performed with the wafer in the chamber and while still under vacuum conditions, thereby driving contaminants off of both the wafer and the chamber interior. The wafer cleaning is performed prior to exposure to atmospheric water vapor which can initiate corrosion.

REFERENCES:
patent: 4379832 (1983-04-01), Dalal et al.
patent: 5417826 (1995-05-01), Blalock

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