Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-14
2007-08-14
Datskovsky, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C029S739000
Reexamination Certificate
active
10830183
ABSTRACT:
A method and an assembly of the invention are intended for connecting two parts via a spacer made from a heat-shrinkable material shrinkable only in one direction. The spacer is sandwiched between the parts and attached to both parts with such orientation that direction of the shrinkage of the spacer coincides with the direction of movement of both parts towards each other. After the parts and the spacer are interconnected, the spacer is heated for causing said parts to move closer to each other. The space between the parts can be filled with an adhesive material so that the parts will be held together without the use of clamps or binding bands while the adhesive is cured. Another application is to attach a heatsink to an electronic device supported by a PC board. Shrinkage of the spacer under effect of heating brings the electronic device into a tight heat-transferring contact with the heatsink and maintains this contact irreversibly. Another embodiment of the invention provides a spacer made from electroconductive heat-shrinkable material and is used not only for improving a heat-transfer contact between the source of heat and the heatsink, but also for grounding the heatsink against EMI.
REFERENCES:
patent: 4005457 (1977-01-01), Hill et al.
patent: 5331513 (1994-07-01), Hirai et al.
patent: 5359768 (1994-11-01), Haley
patent: 5549155 (1996-08-01), Meyer
patent: 5571992 (1996-11-01), Maleski et al.
patent: 5988689 (1999-11-01), Lever
patent: 6075699 (2000-06-01), Rife
patent: 6201697 (2001-03-01), McCullough
patent: 6583987 (2003-06-01), Skinner et al.
patent: 6683796 (2004-01-01), Radu et al.
patent: 6695042 (2004-02-01), Boudreaux et al.
patent: 7006353 (2006-02-01), Matteson
patent: 04254343 (1992-09-01), None
patent: 09027515 (1997-01-01), None
English translation of Yoshida et al. (JP 04-254343), Sep. 9, 1992.
Holland Shielding Systems BV, Netherlands “Conductive Metallization/Coating” (Advertisement).
Erez Shmuel
Geva Ehood
Datskovsky Michael
Hoffberg Robert J.
LandOfFree
Device and method for fastener-free connection via a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device and method for fastener-free connection via a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device and method for fastener-free connection via a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3895533