Device and method for fabricating double-sided SOI wafer...

Details Device and method for fabricating double-sided SOI wafer... Device and method for fabricating double-sided SOI wafer...

2006-08-29

2006-08-29

Lindsay, Jr., Walter L. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S738000, C438S667000

Reexamination Certificate

active

07098070

ABSTRACT:
A semiconductor package includes an SOI wafer having a first side including an integrated circuit system, and a second side, opposite the first side, forming at least one cavity. At least one chip or component is placed in the cavity. A through buried oxide via connects the chip(s) to the integrated circuit system.

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