Device and method for extended distance cutting by laser, in...

Electric heating – Metal heating – By arc

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C219S121670, C219S121700, C219S121220

Reexamination Certificate

active

06476350

ABSTRACT:

TECHNICAL FIELD AND PRIOR ART
The invention relates to the field of cutting by laser, in particular with a view to applications to dismantling and/or taking apart.
The technique of dismantling, or taking apart, by laser is distinguished from laser machining by a certain number of characteristics.
Laser machining is effected using a simple physical phenomenon: light of any colour, with a sufficiently high energy level, applied for a sufficiently long time to a target, causes the latter to melt and vaporises the matter or destructures it (in the case of UV lasers). Laser machining makes it possible to perform manufacturing operations which are generally followed by assembly steps themselves making it possible to implement the laser technique (welding, surface treatment, localised alloying, milling).
Thus production laser machining machines comprising laser sources have been produced and sold mainly by machine tool manufacturers. These machines make it possible to process materials in an optimised manner, which makes the machining operations more precise, more rapid, more repetitive, whilst ensuring a very good level of quality for the machined parts.
These techniques use procedures complementary to the emission and control of the laser light proper, and notably the ejection of added gas at the point of impact of the laser beam, in order to eliminate impurities from the area to be treated, to improve the precision of the cutting, to protect the optical devices situated close to the area of impact of the laser on the material, and to create a gaseous microenvironment in the cutting area in order to control the process.
In the case of dismantling or taking apart by laser, the objects to be achieved for a cutting machine are, a priori, very different. It appears in fact that it suffices, for the dismantling operation to be satisfactory, for the size of the cut pieces to correspond to that required by the packing devices allowing the removal of the said cut pieces.
In addition, it cannot be envisaged, in dismantling devices, using appliances making it possible to send an added gas to the area of impact of the laser beam. This is because such appliances should, if they were used, be situated close to the piece to be cut. However, this cannot be envisaged in the case of dismantling, since the laser firing, for reasons of conditions of operation of demolition sites, must be carried out in compliance with a distance between the lens and the piece to be cut, because of the size of the working area (around 1 to 2 m). The laser machines used for dismantling are therefore not very different, in their operating mode, from those used for production of machining.
In addition, a dismantling laser machine is not intended to work, as in the workshop, under stable conditions, but must rather operate under site conditions: it therefore preferably “basic”, compact, lightweight. Controlling the machine is also, preferably, easier than in the case of a workshop machine.
A cutting device is known through the document U.S. Pat. No. 4 870 244. The teachings of this document are based on the use of a biphotonic effect, that is to say on the emission of a first laser radiation which is continuous, or pulsed and relaxed, which melts the material, followed by the emission of a laser pulse of the “Q-switch” type focused on the target constituting the area melted by the first laser, which discharges the material by detonation effect. The use of this method assumes that coordination of the laser pulses is possible and is sufficiently precise to prevent the molten material resolidifying between the two laser pulses, the Q-switch not being able to operate industrially both synchronously and at high power.
According to a variant, this document teaches that the two lasers can be replaced by a single laser operating alternatively in a relaxed mode and in Q-switch switch triggered mode. However, it is clearly stated that, because of the interval of time necessary between the end of functioning in continuous mode and the start of the pulse, a cooling of the molten material on the target may take place, which limits the possibilities of application of this device, or of this method, to targets requiring only low cutting powers (thickness of material probably less than 0.1 mm for steel).
This document does not therefore describe a device which can be used, in a practical fashion, in industrial dismantling operations, having regard to the conditions of simplicity and compactness which this application requires and which have been measured above: this is because the system with two lasers is complex (it uses synchronisation), whilst the system with a single laser is very tricky to apply and of limited application. In all cases the Q-switch technology limits the power of the process.
In addition, through the Q-switch technique used in this document U.S. Pat. No. 4 870 244, the pulses obtained are difficult to program with regard to time in repetitive mode.
Consequently at the present time a laser cutting device is not known which does not use ejection of added gas on the laser impact area, and which remains, at the same time, simple and flexible in use.
In addition, the current techniques of dismantling by laser which generally operate in the workshop, or in a pilot laboratory with added gas, do not make it possible to effect, without added gas, cutting of material having a great thickness (at least 10 mm). An additional problem is posed because of the presence, during raw cutting, of wastes such as gases, or deposits of the metallic ball type.
DISCLOSURE OF THE INVENTION
The invention therefore proposes a laser cutting system which remains simple in structure and use, compatible with applications in the field of dismantling, using no added gas, and being able to operate at distances of several meters between the lens and the piece to be cut.
In addition, even if, as stated above, the degrees of precision or evenness in the cutting are not, a priori, as critical as in the field of machining, the invention proposes a device for obtaining quality cutting. This has two consequences: it becomes possible to effect cuts with a greater thickness (cm), and it is possible to eliminate secondary waste such as deposits in the form, for example, of metallic balls, and to reduce the volume of aerosols or cutting gases produced.
More precisely, the object of the invention is a device for laser cutting, having:
means for emitting a pulsed laser beam, with energy pulses E≧10 joules,
at least one optical fibre for transmitting the laser pulses, from the means of emitting the laser beam in the direction of a piece to be cut,
means of focusing the laser beam, with a focal distance f≧50 cm.
Transmission of the beam by means of an optical fibre makes it possible to operate at a distance. In addition, this method does not use the ejection of added gas, at the area of impact of the laser beam. The use of a focusing lens with a large focal distance (f≧50 cm or 1 m) make it possible to operate at a distance between the lens and the piece to be cut.
The focusing means include an assembly of lenses or one aspheric lens with an index gradient or a telescope. They can also include a hybrid mixture of diffractive and refractive elements.
The power density necessary with regard to the task of focusing the laser beam used without added gas, in accordance with the invention, can be less than that necessary for a conventional laser cutting.
For focusing distances greater than one meter, not using the diffractive lens, a telescope is used with a centred mirror which has the drawback of high diffraction at the edges of the lenses, but with satisfactory astigmatism, or a decentred mirror, which eliminates the diffraction but focuses the beam elliptically along two axes.
Using a laser operating in pulse mode makes it possible to create a high-energy pulsed plasma in the vicinity of the impact area on the piece to be cut. It is because the consequence of the laser pulse is to add to the heating of the material a blast effect which makes it possible to

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Device and method for extended distance cutting by laser, in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device and method for extended distance cutting by laser, in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device and method for extended distance cutting by laser, in... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2927214

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.