Device and method for enhancing thermal and high frequency perfo

Details Device and method for enhancing thermal and high frequency perfo Device and method for enhancing thermal and high frequency perfo

1995-07-26

1996-12-03

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 257713, 257796, 361718, H05K 720

Patent

active

055814441

ABSTRACT:
A method and mount for a high frequency IC that provides a low inductance path for a high frequency current from the IC to the exterior of a package for the IC and the mount. An electrically and thermally conductive metal base for mounting the IC on an upper surface thereof has a lower surface exposed at the exterior of the package that otherwise encloses the base and the IC. The base also has a plurality of solid or hollow columns for increasing a surface area of the mount, thereby decreasing the inductance to a high frequency current in the path between the IC and the lower surface of the base. Each column is electrically connected to a separate ground terminal on the IC. The columns may have narrow necks connecting them to the base to limit common mode inductance between columns, or may be separated from the base to eliminate common mode inductance.

REFERENCES:
patent: 4809044 (1989-02-01), Pryor
patent: 5132896 (1992-07-01), Nishizawa
patent: 5146310 (1992-09-01), Bayan
patent: 5150198 (1992-09-01), Ohikata
patent: 5243217 (1993-09-01), Yamada
patent: 5339216 (1994-08-01), Lin
patent: 5379187 (1995-01-01), Lee
patent: 5409186 (1995-04-01), Chow

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