Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2004-01-06
2009-10-27
Smoot, Stephen W (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C257S787000, C257SE21504, C257SE23125
Reexamination Certificate
active
07608486
ABSTRACT:
The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a position for defining at least one mould cavity, and an opened position in which the mould parts are situated at a greater distance from each other than in the encapsulating position, and feed means for encapsulating material connecting onto the mould cavity. The invention also relates to a method for encapsulating with encapsulating material an electronic component fixed on a carrier.
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Gal Wilhelmus Gerardus Jozef
Teunissen Michel Hendrikus Lambertus
Weggen Martin Herman
Fico B.V.
Smoot Stephen W
The Webb Law Firm
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