Device and method for cutting an assembly

Details Device and method for cutting an assembly Device and method for cutting an assembly

2007-06-19

2007-06-19

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C156S345420

Reexamination Certificate

active

10886436

ABSTRACT:
A method is presented for cutting an assembly that includes two layers of material having a first surface and a second surface. The method includes providing a weakened interface between the two layers that defines an interface ring about the periphery of the assembly, providing a high-pressure zone at the interface ring, and providing at least one controllable low-pressure zone in the vicinity of at least one of the first surface and the second surface. The technique also includes supplying the high-pressure zone with a controllable high-pressure force, and attacking the interface ring with at least one mechanical force in combination with the high-pressure force to cut the assembly.

REFERENCES:
patent: 6221740 (2001-04-01), Bryan et al.
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patent: 6468879 (2002-10-01), Lamure et al.
patent: 6821376 (2004-11-01), Rayssac et al.
patent: 1 107 295 (2001-06-01), None
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patent: 2 796 491 (2001-01-01), None
patent: WO 01/04933 (2001-01-01), None

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