Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2002-01-16
2003-04-29
Paladini, Albert W. (Department: 2827)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S455000, C438S459000, C438S107000, C438S110000, C438S118000, C438S121000, C438S122000, C438S125000
Reexamination Certificate
active
06555444
ABSTRACT:
FIELD
The invention relates to a device and method for core buildup using a separator. More particularly, the present invention is a device and method for dual substrate fabrication based on simultaneous core buildup using a separator.
BACKGROUND
In the rapid development of industrial automation great progress has been made in the mass production of products. The need for advancement in industrial automation is evident in every industry, but even more so in an industry such as chip or processor manufacturing in which competition and fluctuating demand causes prices to remain constant or even decline. Therefore, improvements in the process for manufacturing of a package, as illustrated in
FIG. 1
, to reduce cost is perpetually required.
FIG. 1
is a side view of an example package. A package in this case comprises a die
20
which may be a processor or other chip, an integrated heat spreader
30
, an heat sink
40
, a substrate
10
, and a number of pins
50
. It should be understood that the package illustrated in
FIG. 1
is provided simply as an example and not intended to illustrate all the components in a package. The package would be installed on a printed circuit board such as, but not limited to, a baseboard by inserting the pins
50
into a slot (not shown). The die
20
would communicate to the printed board via substrate
10
and pins
50
.
Outside of the die
20
, the substrate
10
would often be the most complex item within a package and comprise a printed circuit in itself. Therefore, any method that would reduce the cost to manufacture the substrate
10
even slightly would improve profitability for the manufacturer since these units would be manufactured in large quantities.
Therefore, a device and method for manufacturing a substrate
10
is required and that will reduce the time and cost of manufacturing thereby improving the profitability for the entire package.
REFERENCES:
patent: 5780311 (1998-07-01), Beasom et al.
Antonelli Terry Stout & Kraus LLP
Intel Corporation
Paladini Albert W.
Zarneke David A.
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