Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-07-09
2000-07-04
Tolin, Gerald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 361704, 257707, 454184, H05K 720
Patent
active
060847700
ABSTRACT:
A heat sink mounted on an electronic component causes a thermal plume effect so that air adjacent to the electronic component moves through one or more channels in the heat sink in a direction substantially transverse to and away from the electronic component. The heat sink includes a base attachable to the electronic component, a support member mounted on and substantially transverse to the base, and a heat exchanger mounted on the support member and spaced away from the base. The heat exchanger has at least one entry hole adjacent to the base, at least one exit hole at a distance from the entry hole, and one or more channels adjacent to the support member and in flow communication with the entry hole and the exit hole.
REFERENCES:
patent: 4036292 (1977-07-01), Hine, Jr.
patent: 4222434 (1980-09-01), Clyde
patent: 4261005 (1981-04-01), McCarthy
patent: 4449164 (1984-05-01), Carlson
patent: 5063475 (1991-11-01), Balan
patent: 5111280 (1992-05-01), Iverson
patent: 5132875 (1992-07-01), Plesinger
patent: 5172756 (1992-12-01), Jayamanne
patent: 5212625 (1993-05-01), Van Andel
patent: 5369550 (1994-11-01), Kwon
patent: 5402004 (1995-03-01), Ozmat
patent: 5784255 (1998-07-01), Wyland
Integrated Device Technology Inc.
Tolin Gerald
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