Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-12-06
2005-12-06
Rossi, Jessica (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C438S455000, C438S458000, C438S464000, C156S285000
Reexamination Certificate
active
06972069
ABSTRACT:
A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.
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Hecht Franz
Kröninger Werner
Lutzke Melanie
Brown Jayme L.
Greenberg Laurence A.
Locher Ralph E.
Stemer Werner H.
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