Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2005-05-03
2005-05-03
Stoner, Kiley (Department: 1725)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C228S004500, C228S044700, C073S827000
Reexamination Certificate
active
06886734
ABSTRACT:
A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.
REFERENCES:
patent: 3685137 (1972-08-01), Gardiner
patent: 3887998 (1975-06-01), Hartleroad et al.
patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 3960279 (1976-06-01), Hartleroad et al.
patent: 4030657 (1977-06-01), Scheffer
patent: 4361261 (1982-11-01), Elles et al.
patent: 4434347 (1984-02-01), Kurtz et al.
patent: 4527730 (1985-07-01), Shirai et al.
patent: 4600138 (1986-07-01), Hill
patent: 4603803 (1986-08-01), Chan et al.
patent: 4653681 (1987-03-01), Dreibelbis et al.
patent: 4765531 (1988-08-01), Ricketson et al.
patent: 4778097 (1988-10-01), Hauser
patent: 4821945 (1989-04-01), Chase et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 5035034 (1991-07-01), Cotney
patent: 5062565 (1991-11-01), Wood et al.
patent: 5114066 (1992-05-01), Amador et al.
patent: 5148959 (1992-09-01), Cain et al.
patent: 5193733 (1993-03-01), You
patent: 5197652 (1993-03-01), Yamazaki
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5251805 (1993-10-01), Tani et al.
patent: 5291061 (1994-03-01), Ball
patent: 5307978 (1994-05-01), Ricketson et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5331200 (1994-07-01), Teo et al.
patent: 5350106 (1994-09-01), Fogal
patent: 5384155 (1995-01-01), Abbott et al.
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5425491 (1995-06-01), Tanaka et al.
patent: 5445306 (1995-08-01), Huddleston
patent: 5465899 (1995-11-01), Quick et al.
patent: 5486733 (1996-01-01), Yamazaki et al.
patent: 5497031 (1996-03-01), Kozono
patent: 5497032 (1996-03-01), Tsuji et al.
patent: 5513792 (1996-05-01), Onitsuka
patent: 5516023 (1996-05-01), Kono
patent: 5591920 (1997-01-01), Price et al.
patent: 5647528 (1997-07-01), Ball et al.
patent: 5673845 (1997-10-01), Ball
patent: 5813590 (1998-09-01), Fogal et al.
patent: 5826778 (1998-10-01), Sato et al.
patent: 5890644 (1999-04-01), Ball
patent: 5894981 (1999-04-01), Kelly
patent: 5904288 (1999-05-01), Humphrey
patent: 5954842 (1999-09-01), Fogal et al.
patent: 6000599 (1999-12-01), Ball et al.
patent: 6047468 (2000-04-01), Fogal et al.
patent: 6047877 (2000-04-01), Ball
patent: 6068174 (2000-05-01), Ball et al.
patent: 6299049 (2001-10-01), Ball et al.
patent: 6334566 (2002-01-01), Ball et al.
patent: 6478211 (2002-11-01), Ball et al.
patent: 60-195945 (1985-10-01), None
patent: 61-190951 (1986-08-01), None
patent: 63-86538 (1988-04-01), None
H.K. Charles, Jr.Electrical Interconnection, pp. 224-236 (no date available).
Ball Michael B.
Fogal Rich
Micro)n Technology, Inc.
Stoner Kiley
TraskBritt
LandOfFree
Device and method for clamping and wire-bonding the leads of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device and method for clamping and wire-bonding the leads of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device and method for clamping and wire-bonding the leads of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3433895