Device and method for bonding wafers

Details Device and method for bonding wafers Device and method for bonding wafers

2005-02-09

2009-10-06

Andújar, Leonardo (Department: 2893)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Reexamination Certificate

active

07598152

ABSTRACT:
The invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces.

REFERENCES:
patent: 4962062 (1990-10-01), Uchiyama et al.
patent: 5500540 (1996-03-01), Jewell et al.
patent: 5569960 (1996-10-01), Kumazawa et al.
patent: 6010591 (2000-01-01), Gösele
patent: 6180496 (2001-01-01), Farrens et al.
patent: 6320639 (2001-11-01), Mori et al.
patent: 2002/0134503 (2002-09-01), Hussinger et al.
patent: 2003/0045044 (2003-03-01), Dentry et al.
patent: 2003/0122141 (2003-07-01), Wong et al.
patent: 0886306 (1998-12-01), None
patent: 1278245 (2003-01-01), None
patent: WO2004/010481 (2004-01-01), None
Article entitled: “Schutzkappe für Mikrosysteme,” Hans-Ulrich Ehrke, F&M, Issue 107, 1999, pp. 74-76. {English Abstract translation is attached}.
“SB6/8e Semi-Automated Wafer Bonding System, Precision Wafer Bonding Solution,” http://www.suss.com/products/wafer—bonder/semi—automated—wafer—bonders/sb6-8e, accessed May 19, 2008.

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