Device and method for aligning disk-shaped substrates

Material or article handling – Article reorienting device

Reexamination Certificate

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C414S757000, C414S936000

Reexamination Certificate

active

07004716

ABSTRACT:
The invention relates to a simple and cost-effective method for aligning substrates. In order to achieve this, the invention provides a device for aligning disc-shaped substrates, in particular semiconductor wafers, comprising an alignment detection unit, at least one first support for receiving the substrate, which forms an oblique plane in relation to the horizontal, a stop against which the substrate can be displaced as a result of the oblique angle and a rotational device for rotating the substrate. The invention also relates to a method for aligning disc-shaped substrates, in particular semiconductor wafers, comprising the following steps: displacement of the substrate into an oblique position in relation to the horizontal, in which the substrate is held on a support which forms a tilted plane in relation to the horizontal and lies against a stop as a result of the oblique angle; rotation of the substrate into a predefined rotational position; and monitoring of the rotational position using a detection unit.

REFERENCES:
patent: 3982627 (1976-09-01), Isohata
patent: 3993018 (1976-11-01), Kranik et al.
patent: 4887904 (1989-12-01), Nakazato et al.
patent: 5183378 (1993-02-01), Asano et al.
patent: 5848670 (1998-12-01), Salzman
patent: 6116848 (2000-09-01), Thomas et al.
patent: 3506782 (1985-10-01), None
Japanese 60057948, one page Abstract & drawing, Apr. 1985.
JP 04 157752 , Patent Abstracts of Japan.
JP 60057948, Patent Abstracts of Japan.

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