Developing solution and pattern forming method using the same

Details Developing solution and pattern forming method using the same Developing solution and pattern forming method using the same

1989-11-28

1992-06-16

Padgett, Marianne

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 36, 427 431, 427 541, 427 38, 430296, 430312, 430324, B05D 306, G03C 500

Patent

active

051223872

ABSTRACT:
The invention relates to a developing solution of polydimethyl glutarimide containing acetone, ethyl alcohol, or propyl alcohol and, water, and alkali, and a pattern forming method using the same. According to the invention, a finer pattern than before may be formed by using PMGI resist film. At the same time, a liftoff process excellent in dimensional controllability and high in reliability than in the prior art will be realized. Besides, in the wet etching process of using the two-layer resist pattern of the invention as the mask on the GaAs substrate, since the adhesion of the lower layer resist to the substrate is superior, the recess width when etching the substrate can be stably controlled, so that a device of high performance may be obtained. Furthermore, in the process of using the PMGI resist film in the lower layer and the PMMA resist film in the upper layer, since the PMMA resist film and PMGI resist film possess mutually appropriate electron beam sensitivity and deep ultraviolet light sensitivity, mixed exposure by electron beam and deep ultraviolet light may be applied, so that a stable hybrid exposure may be effected at a high through-put.

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