Developing method and apparatus

Details Developing method and apparatus Developing method and apparatus

1995-01-27

1996-09-10

Rutledge, D.

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

Removing at least one of the self-sustaining preforms or a...

354325, 216 84, G03D 302, G03D 500

Patent

active

055552340

ABSTRACT:
A desired pattern is exposed to a substrate surface having a photosensitive resin film formed thereon, and thereafter a prewetting liquid and a developer are successively supplied to the substrate surface. A diaphragm mounted in a prewetting liquid supply nozzle applies ultrasonic vibration to the prewetting liquid to be supplied to the substrate surface. The ultrasonic vibration applied vibrates minute bubbles of several micrometers in size which are generated when the prewetting liquid is supplied to the substrate surface, thereby causing the bubbles to float to the surface of the prewetting liquid and disappear therefrom. As a result, the substrate surface is modified to be hydrophilic and becomes free of the bubbles. The developer subsequently supplied through a developer supply nozzle uniformly spreads over the entire substrate surface without being obstructed by the bubbles, to avoid non-uniform development.

REFERENCES:
patent: 4326553 (1982-04-01), Hall
patent: 4544446 (1985-10-01), Cady
patent: 4647172 (1987-03-01), Batchelder et al.
patent: 5078832 (1992-01-01), Tanaka
patent: 5100476 (1992-03-01), Mase et al.
patent: 5294505 (1994-03-01), Kamon

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