Developer sheet with structured clays and process thereof

Details Developer sheet with structured clays and process thereof Developer sheet with structured clays and process thereof

1993-03-02

1994-09-27

Hess, B. Hamilton

Record receiver having plural interactive leaves or a colorless

Having a colorless color-former, developer therefor, or...

Identified electron acceptor

503210, 503211, 503212, 503214, 503219, B41M 5155

Patent

active

053507290

ABSTRACT:
A developer composition containing a structured clay having a void volume greater than about 50%, a binder and a developer resin, and a developer sheet comprising a such developer composition on a support are described.

REFERENCES:
patent: 2712507 (1955-07-01), Green
patent: 2730456 (1956-01-01), Green
patent: 3455721 (1969-07-01), Phillips et al.
patent: 3466184 (1969-09-01), Bowler et al.
patent: 3672935 (1972-06-01), Miller et al.
patent: 3732120 (1973-05-01), Brockett et al.
patent: 3737410 (1973-06-01), Mueller
patent: 3900216 (1975-08-01), Hayashi et al.
patent: 3928702 (1975-12-01), Matsukawa et al.
patent: 3963852 (1976-06-01), Baxter
patent: 4020261 (1977-04-01), Oda et al.
patent: 4022735 (1977-05-01), Thompson
patent: 4109049 (1978-08-01), Thompson
patent: 4173684 (1979-11-01), Stolfo
patent: 4226962 (1980-10-01), Stolfo
patent: 4399209 (1983-08-01), Sanders et al.
patent: 4405371 (1983-09-01), Sugahara
patent: 4647952 (1987-03-01), Pokora et al.
patent: 4742041 (1988-05-01), Ikeda et al.
patent: 4952278 (1990-08-01), Gregory et al.
patent: 5061346 (1991-10-01), Taggart et al.

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