Coating apparatus – With means to apply electrical and/or radiant energy to work... – With electromagnetic and/or electrostatic removal of...
Patent
1977-11-23
1980-03-18
Stein, Mervin
Coating apparatus
With means to apply electrical and/or radiant energy to work...
With electromagnetic and/or electrostatic removal of...
118657, 430122, G03G 1309
Patent
active
041933761
ABSTRACT:
A developer powder supply means is disposed within a developer reservoir for supplying developer powder to a magnet brush developing roller which is placed adjacently to a drum surface carrying an electrostatic latent image formed thereon. The developer powder supply means comprises a stationary sleeve and a rotatable cylindrical magnet enclosed by the stationary sleeve. The rotatable cylindrical magnet includes a magnet shunt means or has an odd number of magnetic poles to produce distorted distribution of the magnetic field. The stationary sleeve has an extended portion which is placed above the rotatable cylindrical magnet, where the magnetic field established by the rotatable cylindrical magnet does not effect the developer powder.
REFERENCES:
patent: 2975758 (1961-03-01), Bird, Jr.
patent: 3584601 (1971-06-01), Turner
patent: 3640247 (1972-02-01), Mason et al.
patent: 3914771 (1975-10-01), Lunde et al.
patent: 4003335 (1977-01-01), Kurita et al.
patent: 4030447 (1977-06-01), Takahashi et al.
patent: 4048958 (1977-09-01), Nakaguchi et al.
patent: 4067295 (1978-01-01), Parker et al.
patent: 4081571 (1978-03-01), Nishihama et al.
patent: 4112867 (1978-09-01), Suzuki et al.
Hamaguchi Hiroshi
Kawano Tadaaki
Sharp Kabushiki Kaisha
Stein Mervin
LandOfFree
Developer powder supply in magnet brush development does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Developer powder supply in magnet brush development, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Developer powder supply in magnet brush development will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1120124