Determining the maximum number of dies fitting on a...

Details Determining the maximum number of dies fitting on a... Determining the maximum number of dies fitting on a...

2006-04-25

2006-04-25

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S018000

Reexamination Certificate

active

07033847

ABSTRACT:
Determining the maximum number of dies that fit on a semiconductor wafer is disclosed. The x- and y-coordinates of an initial starting position on a semiconductor wafer are determined. The delta-x and delta-y offsets for subsequent starting positions are also determined. Starting at a current position equal to the initial starting position, the following is repeated for each of a predetermined number of times. First, the semiconductor wafer is covered with fields. Second, the number of dies that are completely covered by the semiconductor wafer is counted. Third, the current starting position is increased by the delta-x and the delta-y offsets. Once this has been repeated, the actual starting position is set as the current starting position at which the number of dies completely covered by the semiconductor wafer is maximized.

REFERENCES:
patent: 6210984 (2001-04-01), Farnworth et al.
patent: 6405357 (2002-06-01), Chao et al.
patent: 6461938 (2002-10-01), Nakabayashi
patent: 6492187 (2002-12-01), Farnworth et al.
patent: 6900459 (2005-05-01), Farnworth et al.
patent: 2001/0001078 (2001-05-01), Nakabayashi

Affiliated with

Also associated with

Rating

Determining the maximum number of dies fitting on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Determining the maximum number of dies fitting on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Determining the maximum number of dies fitting on a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3602419