Determination of thermal impedances of bonding layers in infrare

Electricity: measuring and testing – Conductor identification or location – Inaccessible

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324 71SN, G01R 2702

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active

040126919

ABSTRACT:
A method of determining thermal constants of bonding layers of an infrared ensor which comprises cooling a bonded layer sensor to 77.degree.K and then heating the sensor by a quick pulse of heat. The electrical resistance of the sensor is measured and the measurement continued to determine a thermal profile. The measured thermal profile is compared with a known profile to determine thickness of the bonding layers and the material layers.

REFERENCES:
patent: 3731187 (1973-05-01), Hausler et al.
patent: 3781911 (1973-12-01), Davidson
patent: 3936738 (1976-02-01), Maltby

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