Determination of substrate temperature used during oxygen implan

Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen

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G01J 500

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048051870

ABSTRACT:
The present invention provides graphs and a method of using the graphs to determine the substrate temperature used during oxygen implantation of SIMOX wafers. The method establishes a relationship between the wavelength of minimum transmittance for infrared energy and the implantation temperature. Such relationships are then expressed, in the form of graphs, for various selected oxygen dose and energy levels.

REFERENCES:
patent: 4708677 (1987-11-01), Blank et al.
M. J. Kim et al., "Surface Restoration of Oxygen-Implanted Silicon," Journal of Applied Physics, 54(4), Apr. 1983, pp. 1991-1999.

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