Detector array assembly having bonding means joining first and s

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

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357 30, H01J 4014

Patent

active

048719218

ABSTRACT:
Method and apparatus for providing an improved detector array assembly in which the detectors are electrically connected from one substrate to another through adjoining "bump" connections but are prevented from distortion when an epoxy joining the two substrates hardens by locating the detectors so that the epoxy does not flow adjacent to them.

REFERENCES:
patent: 4350886 (1982-09-01), Pommerrenig
patent: 4449044 (1984-05-01), Rotolante et al.
patent: 4530001 (1985-07-01), Mori et al.
patent: 4570329 (1986-02-01), Paine et al.
patent: 4729003 (1988-03-01), Schulte et al.
patent: 4783594 (1988-11-01), Schulte et al.

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